Lightweight design and very high density, microComp? is an alternative to HD DSUB with superior characteristics,A flexible alternative to MIL-STD 83513 connectors.
Dismountable contacts for wiring flexibility
Lightweight composite materials
High vibration withstanding
| 屬性 | 數值 |
|---|---|
| 觸點數目 | 25 |
| 性別 | 公插 |
| 主體定位 | 直向 |
| 安裝類型 | 通孔 |
| 節距 | 2.0mm |
| 端接方法 | 焊接 |
| 額定電流 | 2.5A |
| 外殼材料 | 聚合物 |
| 系列 | 8MCNF |
| 觸點電鍍 | 金 |
| 觸點材料 | 銅合金 |
